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Sr Packaging Design Engineer, Electronics
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Job Location: Buffalo, NY
JOB DESCRIPTION

Job #: 23991
Title: Sr Packaging Design Engineer, Electronics
Job Location: Buffalo, New York - United States
Employment Type:
Salary: contact recruiter for details
Employer Will Recruit From: Nationwide
Relocation Paid?: Yes

WHY IS THIS A GREAT OPPORTUNITY?

Summary

The Sr. Electronics Packaging Engineer to play a critical role in taking our systems to the next level of performance. You will create leading edge packaging solutions for state-of-the-art power, control, and data acquisition systems. Challenges include high power dissipations, high voltages, and extreme thermal and dynamic environments. Your experience with high power and/or high voltage systems in electronics hardware mechanical design is ideal.

JOB DESCRIPTION

Summary

The Sr. Electronics Packaging Engineer to play a critical role in taking our systems to the next level of performance. You will create leading edge packaging solutions for state-of-the-art power, control, and data acquisition systems. Challenges include high power dissipations, high voltages, and extreme thermal and dynamic environments. Your experience with high power and/or high voltage systems in electronics hardware mechanical design is ideal.

QUALIFICATIONS

Qualifications include:

  • Masters Degree in Mechanical, Aeronautical or Electrical Engineering
  • Bachelor`s Degree will also be considered with the appropriate experience
  • 5 years of experience with the packaging of electronics systems intended to be used in severe thermal and dynamic environments
  • Knowledgeable of materials and processes relevant to aerospace electronics
  • Familiar with MIL-STD-810 and MIL-STD-1540
  • Experience with solid modeling tools such as Unigraphics NX.
  • Experience with thermal and structural analysis of aerospace electronics systems is required.
  • Security Clearance a plus, but not required

Education:
University - Bachelor`s Degree/3-4 Year Degree




How to Apply:


 
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